【LPDDR6 Global First Mass Production | CXMT × Xiaomi 18 Fold Ushers in a New Era of High-End Storage】

CXMT Technology officially announced the global first mass production of its self-developed LPDDR6, which is first used in the Xiaomi 18 Fold foldable flagship,

marking the first time a domestic storage company has secured a first-mover advantage in the commercialization of the next-generation memory standard.

This chip uses a 1295-ball POP stacked package, achieving a peak speed of 12800Mbps and a maximum capacity of 16GB.

Leveraging a four-channel architecture to optimize latency and power consumption, it is a core hardware component for the deployment of edge AI computing power,

signaling a breakthrough in the long-standing overseas monopoly on high-end storage.

As early as the beginning of August, KLD had completed the pre-demonstration solution for the **BGA1295 LPDDR6 high-speed test socket**, proactively meeting the verification requirements of the next-generation POP stacked chip. The product uses micron-level precision conductive contacts, supporting tens of thousands of cycle endurance tests to ensure the integrity of the 12800Mbps high-speed signal, covering the entire process of chip reliability verification and aging testing.

Adhering to the business philosophy of **technological innovation, quality as the foundation, efficient service, and win-win value sharing**, KLD insists on a differentiated customization approach, rapidly responding to the short-cycle R&D needs of domestic memory products. With stable and reliable testing solutions, it helps domestic memory and terminal ecosystems achieve collaborative breakthroughs, empowering the wave of domestic semiconductor equipment development.

1. Global First Launch | Domestic LPDDR6 Achieves First Mass Production and Commercialization, Seizing the High Ground in Industry Technology

2. High Speed ​​and High Density | 1295 Ball POP Package, Peak Bandwidth 12800Mbps, Targeting Edge AI

3. Precision Verification | BGA1295 High-Speed ​​Test Socket, High Reliability and Durability, Ensuring Full-Process Chip Testing

4. Win-Win Ecosystem | Technological Collaboration Empowers the Domestic Memory Industry Chain, Practicing the Concept of Win-Win Value Sharing